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Teledyne e2v and Infineon Partner to Provide Processor Boot Optimization for Edge Computing Space Systems

Teledyne e2v and Infineon Partner to Provide Processor Boot Optimization for Edge Computing Space Systems

 

 

【Lansheng Technology Information】July 14, 2023 - Infineon Technologies and Teledyne e2v have developed a reference design for computing-intensive space systems. The design is centered around a Teledyne e2v QLS1046-Space edge computing module configured with 64 megabytes of radiation-hardened Infineon SONOS-style NOR Flash memory for high-performance space processing applications. This reference design addresses two persistent challenges of working in space: weight and communication limitations. The design reduces the number of components in the computing system, enabling edge computing, helping to reduce latency and overcome communication limitations.

 

The QLS1046-Space module belongs to the Teledyne e2v Qormino® product family and integrates 4 GB DDR4 memory and a 64-bit Quad Arm® Cortex® A72 processor. Therefore, the module requires non-volatile memory to boot. The radiation-hardened SONOS-based Inlink CYRS17B512 non-volatile memory is highly optimized for processor boot and FPGA configuration. Since the memory supports 1.8V voltage, its QSPI bus can be directly connected to the QLS1046-Space module without using a voltage converter. In addition, two SONOS NOR Flash memories can be used for redundant design to meet space requirements.

 

Both the QLS1046-Space module and the CYRS17B512 memory are highly radiation resistant, ensuring safe operation and long life even when deployed in space. Their combined design can achieve a total ionizing dose (TID) of 100 krad(Si), and a single particle lock-in (SEL) immunity of 60 MeV.cm2/mg.

 

"Our CYRS17B512 NOR Flash memory and Teledyne e2v's QLS1046-Space processor module are ideally suited to work together in demanding space designs," said Helmut Puchner, Vice President and Fellow of Memory Solutions at Infineon Aerospace and Defense. Components are key to space-based solutions for HPC applications, and we expect this reference design integrating these two key components will generate strong market interest."

 

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